2015 hot LED technology upgrade trend

In 2014, LED products and technologies are continuously updated, but applications are still in the research and development and testing stages, such as plant lighting. Some emerging areas have just started and there is no visible light communication. It is estimated that in 2015, with the accumulation and explosion of technologies, these technologies and products will enter the stage of mature technology and wide application in the market. This article, let's take a look at the more popular 2015 technology will be what progress.

Chip, package and its application

From the development of LED lighting technology point of view, first of all from three aspects: chip, package, application and other aspects of technology.

Chip: With the improvement of LED luminous efficiency, on the one hand LED chips are getting smaller and smaller, the number of chips that can be cut in a certain size of epitaxial wafer is more and more, thus reducing the cost of single chip; on the other hand, The bigger and bigger, as it is now 3W, the future will be to 5W, 10W development, which have the power requirements of the lighting applications can reduce the number of chips to reduce the cost of the application system, and there are many enterprises in this area to develop.

In addition, LED chip technology has been the pursuit of high luminous efficiency as the driving force, and flip-chip technology is currently one of the major technologies to obtain high-power LED chips, the substrate material sapphire and its accompanying vertical structure of the laser substrate stripping Technology (LLO) and new bonding technologies will still dominate for a longer period of time.

Package: Chip-scale package, LED filament package, high color rendering index and wide color gamut will be the future trend of packaging technology. Transparent conductive film, surface roughening technology, DBR reflector technology to enhance the efficiency of LED lamp beads Regular dress packaging is still the mainstream technology; flip-structured COB / COF technology is also the packaging manufacturers focus, integrated package light engine Will be the focus of R & D, in the past 2014, look at all major lighting exhibition also COB packaging technology is everywhere, not beyond reach. At the same time, the power will become the mainstream package, the current market products are mostly high-power LED products or low-power LED products, although they have their own advantages, but there are also insurmountable defects, combined with the advantages of both the power LED products came into being.

In addition, driven by cost factors, the de-power scheme gradually becomes an acceptable product, while the high-voltage LED fully caters to the de-power scheme, but the chip reliability needs to be solved. With low thermal resistance, light type, welding-free and low cost advantages, COB applications will be widely available in the future. There is the application of new materials in the package. Materials such as thermosetting materials EMC, thermoplastic PCT, modified PPA, and ceramic-based plastics, such as high temperature resistance, UV resistance and low water absorption, will be widely used.

Application: The current application manufacturers mainly through the use of new thermal materials, advanced optical design and application of new optical materials and other means to achieve cost-optimized LED lighting products, and to ensure product performance. However, in the future, LED lighting application manufacturers will focus on: the application based on the requirements of the interchangeable LED light engine technology; based on IoT platform LED intelligent lighting system architecture technology; based on the reliability of the design of LED lighting development, use of the cycle Development of high-performance LED lighting that maintains color / brightness consistency; development of lamps based on large area diffuser technology; lighting technology solutions and service systems for on-line light environments.

In addition, the traditional lighting fixtures are designed around the shape and size of the light source, fixed size. The characteristics of LED lighting is: lamps and lanterns shape free, creative appearance; lamps and lanterns size is free, the size is flexible, the lamp position is free, the installation is free. Future LED lamp shape will no longer be confined to the shape of the traditional lamps, and tend to shape the freedom and hidden. Shape freedom to meet individual needs on the one hand, on the other hand can be embellished as decorations.