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Recently, it is reported that the backlight of Samsung's electronic TV products will be fully flip-chip packaged (FlipChip) devices, which is undoubtedly a positive answer to some practitioners who still have doubts about flip-chip packaging. And Tang Guoqing, the general manager of Samsung LED China, is definitely saying that this year's popular gold-free packaging!
Tang Guoqing said that from the technical point of view, no gold wire packaging has been relatively mature. At present, Samsung LED has seen a huge market prospect of this package form, and has the ability to mass produce 3535B (second generation) of high-power packaged light source device without gold wire.
It is understood that Samsung LED's gold-free package 3535B can reach 140lm / W (@350mA), the company has plans to terminate the production of gold wire products, go all out to develop gold-free packaging products.
In addition to the obvious movements of Samsung Electronics, Ronda Electronics also exhibited a non-supported light source device based on the gold-free line at this year's Frankfurt exhibition, the so-called unpackaged product. The company plans to achieve unpackaged products at the end of the second quarter. Mass production. The move is also seen as a move by Taiwanese companies to quickly cut into gold-free products.
Compared with the full deployment of Samsung Electronics, Ronda Electronics said that the unpackaged white LED technology is still in its infancy, and the maturity and market acceptance of this product technology will take some time, and will not immediately produce SMD and cob. Great impact.
In the short term, in addition to actively promoting unpackaged white LED products and technologies, Lunda Electronics will continue to focus on products with high SMD and COB market acceptance.
However, Longda Electronics believes that in the future, after the products and markets are relatively mature, no packaged products are more competitive than traditional SMD and COB in terms of light efficiency or price. In addition, unpackaged products have the same flexible patching method as SMD, and with the investment of more manufacturers, this technology has the opportunity to become the mainstream packaging form in the future.
From the attitude of well-known foreign manufacturers, it can be seen that although the gold-free packaging has not yet become the mainstream, it is already a flower among the flowers, Tang Guoqing said.
Downstream enterprises benefit No matter whether the survival status of most mid-stream enterprises will be squeezed by gold-free lines, downstream application enterprises will undoubtedly become the beneficiaries of this technology.
Previously, TSMC has partnered with mainland company Topstar Lighting to develop luminaire products using POD (PhosphoronDie) packaged devices.
As a company in the application of lighting, what is the actual experience of this technology? According to the reporter, Liao Guochun, general manager of the LED division of Tongshida, understands that this package form does not require reflow soldering at the application terminal, and the package factory can also customize the design according to customer requirements.